Getting Started

Operating Mode Switching (I2C/SPI)

• Default State: Factory-configured for I2C mode, eliminating the need for additional operations.

• SPI Mode Switching Steps:

  • Remove the 0Ω resistor at the "I2C" position on the board (as indicated in the figure below) and re-solder it to the "SPI" side pad;
  • Solder one 0Ω resistor each to the pads beneath the "H" silkscreen corresponding to "CSB" and "MISO" on the right side (to ensure stable SPI signal transmission).

  

I2C Address Configuration (Effective Only in I2C Mode)

The I2C address of the BMV080 sensor is determined by the voltage levels of the CSB and MISO pins (pad configuration). The correspondence is as follows:

Usage Notes

Startup Timing Requirements

Upon power-up, the BMV080 executes hardware initialization, laser warm-up, optical system self-test and other routines. Its hardware startup takes a minimum of 1.9 seconds in polling mode and a maximum of 2.9 seconds in IRQ interrupt mode. A 10-second integration time is required for standard data convergence, while a 30-second warm-up period is necessary to achieve fully stabilized high-precision measurements.
To avoid erroneous readings, the host MCU firmware shall implement logic consisting of a ≥2.9 s initialization delay together with sensor ready state validation. Valid particulate data shall only be fetched after the sensor completes hardware startup, finishes the full 10-second integration cycle, and reports no obstruction or out-of-measurement-range alerts.

Installation and Measurement Requirements

• Measurement Distance: For measurements on white reflective surfaces perpendicular to the laser emission direction, the distance between the sensor and the measured surface must be ≥ 350mm.
• Occlusion Handling: Temporary occlusion will cause data interruption, but normal output will resume after the obstruction is removed.
• Pin Header Soldering: If using pin headers, they must be soldered on the sensor's backside (with pins facing downward) to avoid blocking the laser lens.

Maintenance Points

• Do not disassemble or lift the optical protective cover. Opening the cover will render the sensor permanently inoperable.
• Avoid dropping or severe impact during operation. The optical cover and lens assembly are prone to cracking or detachment under shock.
• Install the device away from continuously vibrating equipment such as fans and motors. Long-term resonance will gradually compromise the securing structure of the optical cover.
• If the device operates long-term in high-humidity or heavy oil fume environments, ensure full-unit sealing to prevent moisture and oil contamination from accumulating on optical components, which would impair the sealing stability of the cover.
• Dust accumulation on the BMV080 transparent protective cover blocks light transmission, degrades measurement accuracy and may even trigger an obstruction alarm. Inspect and clean the lens regularly (gentle wiping with a lint-free cloth is recommended).